US Patent Issued to iSABers Japan, Tadatomo SUGA on July 8 for "Method for bonding substrate, transparent substrate laminate, and device provided with substrate laminate" (Japanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,351,511, issued on July 8, was assigned to iSABers Japan Co. Ltd. (Tokyo) and Tadatomo SUGA (Nakano-ku, Japan).

"Method for bonding substrate, transparent substrate laminate, and device provided with substrate laminate" was invented by Tadatomo Suga (Nakano-ku, Japan) and Yoshiie Matsumoto (Shinjuku, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods of bonding substrates are provided, including forming a thin film of a metal oxide on a bonding surface of both or either of a pair of substrates, at least one of which is a transparent substrate, and contacting the bonding surfaces of the pair of substrates with each other via the thin film of the...