US Patent Issued to INVENTEC (PUDONG) TECHNOLOGY, INVENTEC TECHNOLOGY on May 27 for "Adjustable heat source simulation assembly, chassis heat dissipation detection device and cabinet heat dissipation detection device" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,447, issued on May 27, was assigned to INVENTEC (PUDONG) TECHNOLOGY Corp. (Shanghai) and INVENTEC TECHNOLOGY Corp. (Taipei, Taiwan).

"Adjustable heat source simulation assembly, chassis heat dissipation detection device and cabinet heat dissipation detection device" was invented by Han-Chih Hsieh (Taipei, Taiwan) and Pai-Yi Huang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure relates to an adjustable heat source simulation assembly includes at least one first simulation heater, a second simulation heater and a power output module. The at least one first simulation heater and the second simulation heater are configured...