US Patent Issued to INVENTEC (PUDONG) TECHNOLOGY, INVENTEC on Oct. 7 for "Liquid cooling plate assembly and server" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,551, issued on Oct. 7, was assigned to INVENTEC (PUDONG) TECHNOLOGY Corp. (Shanghai) and INVENTEC Corp. (Taipei, Taiwan).

"Liquid cooling plate assembly and server" was invented by Jingnan Zhao (Shanghai) and Yi-Dong Ji (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A liquid cooling plate assembly is configured to be in thermal contact with a first heat source and a second heat source. The liquid cooling plate assembly includes a cold plate and a plurality of heat pipes. The cold plate includes a plate body and a plurality of fins. The plate body is configured to be in thermal contact with the first heat source and the second heat source, t...