ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,448, issued on May 27, was assigned to INVENTEC (PUDONG) TECHNOLOGY Corp. (Shanghai) and INVENTEC Corp. (Taipei, Taiwan).
"Liquid cooling plate and server" was invented by Jiang-jun Wu (Shanghai), Jingnan Zhao (Shanghai) and Peng Yu (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "A liquid cooling plate is configured to be in thermal contact with at least one first heat source and at least one second heat source. The liquid cooling plate includes at least one first heat dissipation part and a second heat dissipation part. The first heat dissipation part is configured to be in thermal contact with the first heat source and has a fluid chamber...