US Patent Issued to INVENTEC (PUDONG) TECHNOLOGY, INVENTEC on March 25 for "Shielding cover and circuit board assembly" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,518, issued on March 25, was assigned to INVENTEC (PUDONG) TECHNOLOGY Corp. (Shanghai) and INVENTEC Corp. (Taipei, Taiwan).

"Shielding cover and circuit board assembly" was invented by Yu Shu Tai (Taipei, Taiwan) and Chih-Cheng Li (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board assembly includes a circuit board, a noise source and a shielding cover. The circuit board has an upper surface, a lower surface and a plurality of grounding areas. The lower surface faces away from the upper surface, and the grounding areas are located at the lower surface. The noise source is located at the upper surface of the circuit board....