ALEXANDRIA, Va., March 12 -- United States Patent no. 12,250,790, issued on March 11, was assigned to INVENTEC (PUDONG) TECHNOLOGY Corp. (Shanghai) and INVENTEC Corp. (Taipei, Taiwan).
"Liquid cooling device" was invented by Jiang-Jun Wu (Shanghai), Yi-Dong Ji (Shanghai), Shu-Kang Han (Shanghai) and Ke Sun (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "A liquid cooling device includes a base plate, a cooling body, and a cover plate. The cooling body includes a frame. A cooling layer is provided in the frame and a reflux layer is provided above the cooling layer. The cooling layer is provided with a plurality of cooling channels extending from a center portion of the cooling body to the frame. The r...