US Patent Issued to INVENTEC (PUDONG) TECHNOLOGY, INVENTEC on April 29 for "Manifold assembly and manifold" (Chinese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,863, issued on April 29, was assigned to INVENTEC (PUDONG) TECHNOLOGY Corp. (Shanghai) and INVENTEC Corp. (Taipei, Taiwan).

"Manifold assembly and manifold" was invented by Biao Li (Shanghai), Lei Zhou (Shanghai) and Lian-Fei Zhang (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manifold assembly includes a liquid inlet pipe, a plurality of transparent windows and a liquid return pipe. The liquid inlet pipe has a first accommodating space, a first liquid inlet, a plurality of first liquid outlets and a plurality of openings. The first accommodating space is configured to accommodate a cooling liquid, and is in fluid communication with the ...