ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,466,726, issued on Nov. 11, was assigned to InvenSense Inc. (San Jose, Calif.).
"Method and system for fabricating a MEMS device cap" was invented by Daesung Lee (San Jose, Calif.) and Alan Cuthbertson (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A device includes a substrate comprising a first standoff, a second standoff, a third standoff, a first cavity, a second cavity, and a bonding material covering a portion of the first, the second, and the third standoff. The first cavity is positioned between the first and the second standoffs, and the second cavity is positioned between the second and the third standoffs. The first cavity c...