US Patent Issued to International Business Machines on Sept. 9 for "TopVia interconnect with enlarged via top" (New York, Vermont Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,833, issued on Sept. 9, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"TopVia interconnect with enlarged via top" was invented by Lawrence A. Clevenger (Saratoga Springs, N.Y.), Chen Zhang (Guilderland, N.Y.), Brent Anderson (Jericho, Vt.) and Nicholas Anthony Lanzillo (Wynantskill, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A top via interconnect with enlarged via top and a fabrication method therefor. One embodiment may comprise a semiconductor interconnect structure, comprising a first dielectric layer having a top surface, a bottom metal line formed in the dielectric layer, a second dielectric layer deposited ab...