US Patent Issued to International Business Machines on Sept. 30 for "TSV and backside power distribution structure" (New York Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,408, issued on Sept. 30, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"TSV and backside power distribution structure" was invented by Mukta Ghate Farooq (Hopewell Junction, N.Y.) and Ruilong Xie (Niskayuna, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes an electronic circuit within a device layer; wherein the device layer is between a thin layer of wiring for signal connections having a first thickness and a thick layer of wiring for power having a second thickness, the second thickness being greater than the first thickness; a silicon layer above the device layer, the thin layer of wiri...