US Patent Issued to International Business Machines on Sept. 30 for "Fatigue failure resistant electronic package" (New York, New Jersey Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,404, issued on Sept. 30, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Fatigue failure resistant electronic package" was invented by Kamal K. Sikka (Poughkeepsie, N.Y.), Shidong Li (Hopewell Junction, N.Y.), Tuhin Sinha (Oradell, N.J.) and Jeffrey Allen Zitz (Poughkeepsie, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package comprises a chip having a first temperature sensor. The first temperature sensor is configured to measure a first temperature of the chip in a localized area around the first temperature sensor. The chip package also includes a chip carrier coupled to the chip via a plurality of solder con...