US Patent Issued to International Business Machines on Sept. 16 for "Semiconductor structure with wrapped-around backside contact" (New York Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,419,080, issued on Sept. 16, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Semiconductor structure with wrapped-around backside contact" was invented by Ruilong Xie (Niskayuna, N.Y.), Chanro Park (Clifton Park, N.Y.), Min Gyu Sung (Latham, N.Y.), Kangguo Cheng (Schenectady, N.Y.) and Julien Frougier (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a backside contact, and an unmerged source/drain region. The backside contact is wrapped-around the unmerged source/drain region."

The patent was filed on Oct. 18, 2022, under Application No. 17/968,199.

*For further information, includ...