ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,974, issued on Sept. 16, was assigned to International Business Machines Corp. (Armonk, N.Y.).
"Decoupling capacitance in backside interconnect" was invented by Rajiv Joshi (Yorktown Heights, N.Y.), Nicholas Anthony Lanzillo (Wynantskill, N.Y.) and Ruilong Xie (Niskayuna, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of present invention provide a semiconductor structure. The semiconductor structure includes a semiconductor chip having a frontside and a backside; a first metal level at the backside of the semiconductor chip; a second metal level above the first metal level; a plurality of damascene vias extending from the second m...