US Patent Issued to INTERNATIONAL BUSINESS MACHINES on Sept. 16 for "Circuit interconnect structure" (New York Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,926, issued on Sept. 16, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.).

"Circuit interconnect structure" was invented by Sagarika Mukesh (Albany, N.Y.), Fee Li Lie (Albany, N.Y.), Hosadurga Shobha (Shobha, N.Y.) and Devika Sarkar Grant (Rensselaer, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "One or more systems, devices and/or methods provided herein relate to a circuit device having a modular or selectively designed interconnect structure with a plurality of conformal features. In the semiconductor realm, such achievements can allow for fabrication of a device with sub 18 nanometer (nm) or lesser pitch between adjace...