US Patent Issued to International Business Machines on Oct. 7 for "Standoff and support structures for reliable land grid array and hybrid land grid array interconnects" (Minnesota, North Carolina, New York Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,542, issued on Oct. 7, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Standoff and support structures for reliable land grid array and hybrid land grid array interconnects" was invented by Mark K. Hoffmeyer (Rochester, Minn.), Sarah K. Czaplewski-Campbell (Rochester, Minn.), Brian Beaman (Cary, N.C.) and Yuet-Ying Yu (Hopewell Junction, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein is a method for producing a land grid array (LGA) socket connector assembly and the resultant assembly. The method comprises providing a carrier having a first carrier thickness with an array of vias, each having a first diame...