US Patent Issued to INTERNATIONAL BUSINESS MACHINES on Oct. 7 for "Solder-shielded chip bonding" (New York, New Jersey Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,834, issued on Oct. 7, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.).

"Solder-shielded chip bonding" was invented by Baleegh Abdo (Fishkill, N.Y.) and Jae-Woong Nah (Closter, N.J.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A structure includes a first device having a first chip and a second chip. The second chip has a first side with a plurality of bumps and a second side with a plurality of first superconducting lines. A solder bonded layer attaches the first chip to the second chip. A second device has a first side with a plurality of pads facing the plurality of bumps in the second chip and a second side opposite the fir...