US Patent Issued to INTERNATIONAL BUSINESS MACHINES on Oct. 7 for "Dual redistribution layer structure" (New York Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,046, issued on Oct. 7, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.).

"Dual redistribution layer structure" was invented by Mukta G. Farooq (Hopewell Junction, N.Y.) and James J. Kelly (Schenectady, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating a dual redistribution layer (RDL) interposer structure is provided. The method includes etching a semiconductor substrate to expose natural crystallographic planes to form trenches. The method also includes depositing conductive material within the trenches of the etched semiconductor substrate to form vias for an interposer structure. The method includes p...