US Patent Issued to International Business Machines on Oct. 28 for "Structures and processes for void-free hybrid bonding" (New York Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,709, issued on Oct. 28, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Structures and processes for void-free hybrid bonding" was invented by Roy R. Yu (Poughkeepsie, N.Y.) and Katsuyuki Sakuma (Fishkill, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for bonding a first substrate to a second substrate includes a heatable mounting stage configured to accommodate a first semiconductor substrate on an upward-facing surface and a first stack of semiconductor materials on the first semiconductor substrate; a heatable bond head configured to accommodate a second semiconductor substrate on a downward-facing surfac...