ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,656, issued on Oct. 28, was assigned to International Business Machines Corp. (Armonk, N.Y.).
"Multichip interconnect package" was invented by Akihiro Horibe (Yokohama, Japan), Toyohiro Aoki (Yokohama, Japan), Chinami Marushima (Urayasu, Japan), Takahito Watanabe (Yokohama, Japan) and Takashi Hisada (Hachiouji, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnected semiconductor subassembly structure includes an interconnect structure; a first semiconductor die bonded to a first portion of a top surface of the interconnect structure; a second semiconductor die bonded to a second portion of the top surface of the interconnect structur...