US Patent Issued to International Business Machines on Oct. 28 for "Applying a solderable surface to conductive ink" (New York, Minnesota Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,457,693, issued on Oct. 28, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Applying a solderable surface to conductive ink" was invented by Mark K. Hoffmeyer (Rochester, Minn.) and Prabjit Singh (Poughkeepsie, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Applying a solderable surface to conductive ink may include partially curing a conductive ink trace; applying, to the partially cured conductive ink trace, a conductive paste comprising conductive particles; and curing the partially cured conductive ink trace and the conductive paste."

The patent was filed on Oct. 25, 2023, under Application No. 18/494,187.

*For further ...