US Patent Issued to International Business Machines on Oct. 21 for "Stacked semiconductor devices with topside and backside interconnect wiring" (New York Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,431, issued on Oct. 21, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Stacked semiconductor devices with topside and backside interconnect wiring" was invented by Tao Li (Slingerlands, N.Y.), Liqiao Qin (Albany, N.Y.), Mukta Ghate Farooq (Hopewell Jct, N.Y.), Ruilong Xie (Niskayuna, N.Y.) and Kisik Choi (Watervliet, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An approach for forming semiconductor structure composed of one or more stacked semiconductor devices with a first semiconductor device on a substrate, a first interconnect wiring structure over the first semiconductor device, a second interconnect wiring struct...