US Patent Issued to INTERNATIONAL BUSINESS MACHINES on Oct. 21 for "Multi-layer topological interconnect with proximal doping layer" (New York, Connecticut, New Jersey Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,432, issued on Oct. 21, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.).

"Multi-layer topological interconnect with proximal doping layer" was invented by Ching-Tzu Chen (Ossining, N.Y.), Christian Lavoie (Pleasantville, N.Y.), Guy M. Cohen (Westchester, N.Y.), Utkarsh Bajpai (Delmar, N.Y.), Nicholas Anthony Lanzillo (Wynantskill, N.Y.), Teodor Krassimirov Todorov (Yorktown Heights, N.Y.), Oki Gunawan (Westwood, N.J.), Nathan P. Marchack (New York) and Peter Kerns (Sandy Hook, Conn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnect structure including conducting layers of topological semi-metals and/or topological i...