US Patent Issued to International Business Machines on Nov. 4 for "Interconnect structures with vias having vertical and horizontal sections" (New York, New Hampshire, Vermont Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,128, issued on Nov. 4, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Interconnect structures with vias having vertical and horizontal sections" was invented by Ruilong Xie (Niskayuna, N.Y.), Lawrence A. Clevenger (Saratoga Springs, N.Y.), Albert M. Chu (Nashua, N.H.), Brent A. Anderson (Jericho, Vt.) and Nicholas Anthony Lanzillo (Wynantskill, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic structure comprises a first interconnect line at a first interconnect level, a second interconnect line at a second interconnect level, and at least one via connecting the first interconnect line at the first intercon...