US Patent Issued to INTERNATIONAL BUSINESS MACHINES on Nov. 25 for "Tape head wafer design for multiple formats using same tape" (California, Arizona Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,492, issued on Nov. 25, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.).

"Tape head wafer design for multiple formats using same tape" was invented by Icko E. T. Iben (San Jose, Calif.) and David Lee Swanson (Tucson, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A tape head adapted to 32-, 64-, and 128-channel operation is provided. A plurality of elements is provided, numbering NE, comprising first and second sets of 64 evenly-spaced elements, each set comprising at least a first element and a last element. A plurality of servos is provided, comprising at least a first through sixth servo. The 64 evenly-spaced elements o...