US Patent Issued to International Business Machines on Nov. 25 for "Local interconnects having different material compositions" (New York Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,747, issued on Nov. 25, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Local interconnects having different material compositions" was invented by Chih-Chao Yang (Glenmont, N.Y.), Daniel Charles Edelstein (White Plains, N.Y.), Theodorus E. Standaert (Clifton Park, N.Y.) and Jon Slaughter (Slingerlands, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and formation thereof. The semiconductor device including: a first bottom interconnect formed within a first dielectric layer and located within a logic area of the semiconductor device; a second bottom interconnect formed within the first dielectric lay...