ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,742, issued on Nov. 25, was assigned to International Business Machines Corp. (Armonk, N.Y.).
"Enhanced linerless vias" was invented by Ruilong Xie (Niskayuna, N.Y.), Oleg Gluschenkov (Tannersville, N.Y.), Yasir Sulehria (Niskayuna, N.Y.), Julien Frougier (Albany, N.Y.) and Veeraraghavan S. Basker (Schenectady, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A via connection layer for an electronic package and method for fabricating a via connection layer are provided. The via connection layer includes asymmetric via(s) formed in the via connection layer. The asymmetric via include a first sidewall with a first slope angle in a first direction a...