US Patent Issued to International Business Machines on Nov. 11 for "Resist patterned redistribution wiring on copper polyimide via layer" (New York Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,787, issued on Nov. 11, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Resist patterned redistribution wiring on copper polyimide via layer" was invented by Mukta Ghate Farooq (Hopwell Junction, N.Y.), James J. Kelly (Schenectady, N.Y.), Eric Perfecto (Poughkeepsie, N.Y.), Spyridon Skordas (Troy, N.Y.) and Dale Curtis McHerron (Staatsburg, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor element includes a conductive pad. The semiconductor element further includes a first layer of a first polyimide material having an uppermost surface. The first layer includes a via trench extending through the first layer ...