US Patent Issued to International Business Machines on Nov. 11 for "BEOL interconnect subtractive etch super via" (New York Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,777, issued on Nov. 11, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"BEOL interconnect subtractive etch super via" was invented by Prasad Bhosale (Albany, N.Y.), Nicholas Anthony Lanzillo (Wynantskill, N.Y.), Lawrence A. Clevenger (Saratoga Springs, N.Y.) and Michael Rizzolo (Delmar, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices including a super via connection between levels are provided. The semiconductor device can include a first interlevel dielectric layer, a back-end-of-line (BEOL) interconnect structure disposed in the first interlevel dielectric layer, a second interlevel dielectric layer...