ALEXANDRIA, Va., June 10 -- United States Patent no. 12,292,472, issued on May 6, was assigned to International Business Machines Corp. (Armonk, N.Y.).
"Testing a single chip in a wafer probing system" was invented by Thomas Gentner (Boeblingen, Germany), Alejandro Alberto Cook Lobo (Renningen, Germany) and Otto Andreas Torreiter (Leinfelden-Echterdingen, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for testing at least one single chip in a wafer probing system, at least comprising: providing an adapter plate having an interface surface for contacting a vacuum chuck of the wafer probing system, the adapter plate being configured to accommodate the at least one single chip in a cutout with ...