ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,775, issued on May 27, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.).
"Underfill vacuum process" was invented by Toyohiro Aoki (Yokohama, Japan), Chinami Marushima (Urayasu, Japan), Risa Miyazawa (Isehara, Japan), Akihiro Horibe (Yokohama, Japan) and Takashi Hisada (Hachiouji, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device is formed by dispensing an underfill material around a perimeter of an integrated circuit (IC) chip bonded to a supporting substrate. A void in present in the underfill material that is present between the IC chip and the supporting substrate. An opening is present through at least...