US Patent Issued to International Business Machines on May 20 for "Configurable multi-chip module heatsink for selective dissipation of heat" (Minnesota Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,962, issued on May 20, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Configurable multi-chip module heatsink for selective dissipation of heat" was invented by William James Anderl (Rochester, Minn.), Alex Matos (Rochester, Minn.), Brenda Berg (Rochester, Minn.) and Kevin O'Connell (Rochester, Minn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat sink to selectively dissipate heat from a plurality of heat-generating components. The heat sink includes a plurality of heat pipes, and a base plate configured to locate at least one of the plurality of heat pipes proximate each of the plurality of heat-generating components....