US Patent Issued to International Business Machines on May 13 for "Infrared debond damage mitigation by copper fill pattern" (New York Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,615, issued on May 13, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Infrared debond damage mitigation by copper fill pattern" was invented by Mukta Ghate Farooq (Hopewell Junction, N.Y.), Qianwen Chen (Chappaqua, N.Y.), Shahid Butt (Ossining, N.Y.), Eric Perfecto (Poughkeepsie, N.Y.), Michael P. Belyansky (Halfmoon, N.Y.), Katsuyuki Sakuma (Fishkill, N.Y.) and John Knickerbocker (Monroe, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stack structure that includes: a device wafer, a handler wafer, and a bonding structure disposed between the device wafer and the handler wafer, wherein one or both of the device wafer a...