ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,577, issued on May 13, was assigned to International Business Machines Corp. (Armonk, N.Y.).
"Heterogeneous integrated multi-chip cooler module" was invented by Timothy J. Chainer (Putnam Valley, N.Y.), Todd Edward Takken (Brewster, N.Y.), Joshua M. Rubin (Albany, N.Y.) and Arvind Kumar (Chappaqua, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An exemplary apparatus includes a substrate; a plurality of chips mounted onto the substrate; a plurality of cold plates corresponding to the plurality of chips; means for pressing each of the cold plates toward a corresponding one of the chips; means for delivering coolant flow to the cold plates; and m...