US Patent Issued to INTERNATIONAL BUSINESS MACHINES on March 25 for "Microelectromechanical system (MEMS) interconnect including spring body with at least two spring arms micromachined from silicon substrate" (New York Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,258,264, issued on March 25, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.).

"Microelectromechanical system (MEMS) interconnect including spring body with at least two spring arms micromachined from silicon substrate" was invented by Muir Kumph (Croton on Hudson, N.Y.) and Vivekananda P. Adiga (Ossining, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectromechanical system (MEMS) device and method of fabrication are provided. The MEMS devices includes a silicon substrate. The silicon substrate includes a top surface. An interconnect is machined from the silicon substrate. The interconnect includes at a spring body th...