ALEXANDRIA, Va., March 12 -- United States Patent no. 12,248,003, issued on March 11, was assigned to International Business Machines Corp. (Armonk, N.Y.).
"Clustered rigid wafer test probe" was invented by David Michael Audette (Colchester, Vt.), Grant Wagner (Jericho, Vt.), Peter William Neff (Cambridge, Vt.), Jacob Louis Moore (Milton, Vt.) and Melissa Keefe (Cortlandt Manor, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An IC device test probe has one or more clusters of a plurality of tapered probe tips that taper upon a taper plane that is orthogonal to a seating direction or force vector of the IC device test probe toward the IC device. Each of the plurality of tapered probe tips is seated again...