US Patent Issued to INTERNATIONAL BUSINESS MACHINES on June 3 for "Electrical connections between dissimilar materials at cryogenic temperatures" (New York, Connecticut Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,324,361, issued on June 3, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.).

"Electrical connections between dissimilar materials at cryogenic temperatures" was invented by David Abraham (Croton, N.Y.), John Michael Cotte (New Fairfield, Conn.) and Nicholas A. Masluk (Putnam Valley, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cryogenic electronics device includes a semiconductor chip. A substrate is flip-chip bonded to the semiconductor chip. A plurality of bump bonds are concentrated in a bump region of the semiconductor chip. A plurality of circuit elements are arranged in a predefined region of the semiconductor chip. The...