US Patent Issued to INTERNATIONAL BUSINESS MACHINES on June 10 for "Probe pad with built-in interconnect structure" (New York, Connecticut Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,770, issued on June 10, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.).

"Probe pad with built-in interconnect structure" was invented by Ashim Dutta (Clifton Park, N.Y.), Ruturaj Nandkumar Pujari (Albany, N.Y.), Saumya Sharma (Easton, Conn.) and Chih-Chao Yang (Glenmont, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system includes a wafer including at least an electronic component and a probe pad including a built-in back-end-of-line (BEOL) interconnect structure to test the electronic component. The electronic component is tested by the probe pad without building full BEOL interconnect circuits on the wafer. The probe...