US Patent Issued to International Business Machines on July 8 for "Fine-pitch joining pad structure" (Japanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,983, issued on July 8, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Fine-pitch joining pad structure" was invented by Toyohiro Aoki (Yokohama, Japan), Koki Nakamura (Kawasaki, Japan) and Takashi Hisada (Hachiouji, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes two integrated circuit (IC) chips. The first IC chip includes substrate, a spacer connected to the substrate and including holes, wherein at least one of the holes has a first shape, and solder bumps positioned in the holes, respectively. The second IC chip includes a substrate, electrode pads extending from the substrate and conne...