US Patent Issued to INTERNATIONAL BUSINESS MACHINES on Jan. 13 for "Bonding module and cable design for magnetic tape heads" (California Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,254, issued on Jan. 13, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.).

"Bonding module and cable design for magnetic tape heads" was invented by Brandon Purcell (San Jose, Calif.), Ho-Yiu Lam (Mountain View, Calif.) and Aren Yeghissian-Kanneian (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are devices and methods relating to a magnetic tape head module, including an apparatus comprising a magnetic tape head module including a module bonding pad region including a first row of module bonding pads and a second row of module bonding pads, the first row of module bonding pads and the second row of modul...