O) and shared power terminals for a carrier wafer with a built-in device for bonding with another device wafer" (New York, Vermont Inventors)

Posted On: 2026-02-11

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,785, issued on Feb. 10, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Separated input/output (I/O) and shared power terminals for a carrier wafer with a built-in device for bonding with another device wafer" was invented by Tao Li (Slingerlands, N.Y.), Ruilong Xie (Niskayuna, N.Y.), Chih-Chao Yang (Glenmont, N.Y.) and Brent A. Anderson (Jericho, Vt.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) assembly method is provided. The method includes fabricating a first wafer including a first device with a back end of line (BEOL) and first terminals of first and second types at the BEOL and fabricating a...

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US Patent Issued to International Business Machines on Feb. 10 for "Separated input/output (I/O) and shared power terminals for a carrier wafer with a built-in device for bonding with another device wafer" (New York, Vermont Inventors)