US Patent Issued to International Business Machines on Feb. 10 for "Pixelated chuck for retaining warped semiconductor wafers" (New York, Minnesota Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,671, issued on Feb. 10, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Pixelated chuck for retaining warped semiconductor wafers" was invented by Vinay Pai (Voorheesville, N.Y.), Nikhil Jain (Apple Valley, Minn.), Alex Richard Hubbard (Rensselaer, N.Y.), Cody J. Murray (Burnt Hills, N.Y.) and Richard C. Johnson (Selkirk, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Described is a semiconductor processing system including a measurement tool configured to measure warpage characteristics in a semiconductor wafer. The semiconductor processing system further includes a pixelated surface configured to retain the semiconducto...