ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,428, issued on Dec. 9, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.).
"Airgap spacer for power via" was invented by Ruilong Xie (Niskayuna, N.Y.), Lawrence A. Clevenger (Saratoga Springs, N.Y.), Nicholas Anthony Lanzillo (Wynantskill, N.Y.), Kisik Choi (Watervliet, N.Y.) and Huai Huang (Clifton Park, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "One or more systems, devices and/or methods of use provided herein relate to an airgap spacer for power via. The semiconductor device can comprise a power bar wired to a backside power rail, wherein the power bar is located between a first gate of a first field effect transistor (...