US Patent Issued to International Business Machines on Dec. 2 for "Interconnect structure including patterned metal lines" (New York Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,053, issued on Dec. 2, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Interconnect structure including patterned metal lines" was invented by Ruilong Xie (Niskayuna, N.Y.), Chanro Park (Clifton Park, N.Y.), Julien Frougier (Albany, N.Y.) and Kangguo Cheng (Schenectady, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Interconnect structures including parallel metal lines and cut regions in selected ones of the parallel metal lines are fabricated without damage, even at a very small metal pitch. A dielectric fill in the cut regions has a smaller width than the width of the metal lines. Metal line width can be increased by se...