ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,144, issued on Dec. 16, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Backside self aligned skip via" was invented by Ruilong Xie (Niskayuna, N.Y.), Biswanath Senapati (Mechanicville, N.Y.), David Wolpert (Poughkeepsie, N.Y.), Nicholas Anthony Lanzillo (Wynantskill, N.Y.), Lawrence A. Clevenger (Saratoga Springs, N.Y.), Leon Sigal (Monsey, N.Y.), Brent A. Anderson (Jericho, Vt.), Albert M. Chu (Nashua, N.H.) and Reinaldo Vega (Mahopac, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure including a gate contact above and in direct contact with a top surface of a gate, a backside wiring layer below a...