US Patent Issued to International Business Machines on Aug. 5 for "Sidewall plating of circuit boards for layer transition connections" (New York Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,581, issued on Aug. 5, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Sidewall plating of circuit boards for layer transition connections" was invented by Yuan Yao (Tarrytown, N.Y.) and Todd Edward Takken (Brewster, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board including: a first board material layer having a first planar surface and a first sidewall surface perpendicular to the first planar surface; a first conductive layer on the first planar surface; a second board material layer stacked on the first board material layer and having a second planar surface and a second sidewall surface perpendicular to ...