US Patent Issued to INTERNATIONAL BUSINESS MACHINES on Aug. 19 for "Full wrap around backside contact" (New York Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,396,227, issued on Aug. 19, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.).

"Full wrap around backside contact" was invented by Ruilong Xie (Niskayuna, N.Y.), Kisik Choi (Watervliet, N.Y.), Junli Wang (Slingerlands, N.Y.), Julien Frougier (Albany, N.Y.) and Min Gyu Sung (Latham, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure is presented including a first source/drain (S/D) epi region having a first contact completely wrapping around the first S/D epi region, the first contact electrically connected to a backside power delivery network (BSPDN) and a second S/D epi region having a second contact direct...