US Patent Issued to International Business Machines on Aug. 12 for "Multi function single via patterning" (New York Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,389,811, issued on Aug. 12, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Multi function single via patterning" was invented by Effendi Leobandung (Stormville, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various methods and structures for fabricating a semiconductor structure with vertical vias interconnecting BEOL metallization layers. A first BEOL metallization layer includes a first metallization contact. A second BEOL metallization layer is disposed on the first BEOL metallization layer. The second BEOL metallization layer includes a second metallization contact. A dielectric layer is vertically interposed between th...