ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,545, issued on April 8, was assigned to International Business Machines Corp. (Armonk, N.Y.).
"Embedded metal contamination removal from BEOL wafers" was invented by Devika Sil (Rensselaer, N.Y.), Ashim Dutta (Menands, N.Y.), Yann Mignot (Slingerlands, N.Y.), John Christopher Arnold (North Chatham, N.Y.), Daniel Charles Edelstein (White Plains, N.Y.), Kedari Matam (Albany, N.Y.) and Cornelius Brown Peethala (Slingerlands, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A novel bevel etch sequence for embedded metal contamination removal from BEOL wafers is provided. In one aspect, a method of processing a wafer includes: performing a bevel dry e...