US Patent Issued to Interface Technology (ChengDu), Interface Optoelectronics (Shenzhen), General Interface Solution on Feb. 25 for "In-mold electronic component and method for manufacturing the same" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,233,630, issued on Feb. 25, was assigned to Interface Technology (ChengDu) Co. Ltd. (Chengdu, China), Interface Optoelectronics (Shenzhen) Co. Ltd. (Shenzhen, China) and General Interface Solution Ltd. (Miaoli County, Taiwan).

"In-mold electronic component and method for manufacturing the same" was invented by Ten-Hsing Jaw (Chengdu, China), Han Lung Tsai (Chengdu, China) and I-chang Kuan (Chengdu, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "An in-mold electronic component includes a first film layer, a functional module, a plastic layer, and a lead-out terminal. The first film layer is provided at a top surface of the in-mold electronic compon...