ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,110, issued on June 17, was assigned to Intelligent Memory Ltd. (Kwa Chung, Hong Kong).
"Systems for dismantling of double-sided PCBA" was invented by Ho Wai Phyllis Leung (Ma Wan, Hong Kong), Fung Ling Yeung (Tuen Mun, Hong Kong) and Nok Him Chan (Sheung Shui, Hong Kong).
According to the abstract* released by the U.S. Patent & Trademark Office: "A system for dismantling defective BGA chips from double-sided PCBA having a fix stage and a cooling stage. The fix stage includes at least one shield that prevents hot air from a hot air gun to heat BGA chips that are adjacent to the defective BGA chips. The cooling stage prevents overheating of the BGA chips that are on the opposite s...